Join As Silicon Package Design Engineer At Intel | Apply Now
Job Overview:
| Company | Intel |
|---|---|
| Job Role | Silicon Package Design Engineer |
| Job ID | JR0288677 |
| Work Location | Bangalore, India |
| Work Mode | Hybrid |
| Job Type | Full time |
| Experience | 1-6 years (or fresh Master's graduates) |
| Qualification | B.E / B.Tech / M.Tech |
| Salary | Not disclosed |
| Shift | Shift 1 (India) |
| Careers Page | www.intel.com |
Skills: Cadence Siemens Python Perl Linux SKILL Silicon Packaging Electrical Engineering
Join Intel as a Silicon Package Design Engineer in Bangalore
Intel is hiring a Silicon Package Design Engineer to drive the end-to-end development of advanced substrate designs in Bangalore. This full-time hybrid opportunity is open for engineering graduates and postgraduates with relevant experience or project exposure.
Who Can Apply?
- Bachelor's degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a STEM-related field with 1 to 6 years of hands-on experience via projects, internships, coursework, or training.
- Alternatively, candidates with a Master's degree in a related field with zero prior professional experience are eligible.
- Must have proficiency in EDA tools like Cadence or Siemens for package and PCB design.
- Familiarity with programming languages such as Python, Perl, Linux, and/or SKILL.
- Strong fundamental understanding of electrical field theories and electronic principles.
About Intel:
Intel Corporation is a global technology leader focused on creating world-changing technology that enables global progress and enriches lives. The Assembly and Test Technology Development (ATTD) Design group at Intel drives crucial semiconductor packaging innovations and computing solutions.
What You Will Do as Silicon Package Design Engineer
- Physical Layout Design: Develop physical layout designs for silicon packages, assembly test chips, and Intel's EMIB technologies.
- Cross-Functional Collaboration: Collaborate with customers and electrical engineers to optimize signal integrity and power delivery.
- Bump Patterns & Routing: Create bump patterns, placements, and signal routing planning while adhering to design rules.
- Layout Verification: Conduct routing checks, connectivity validation, DRC, and electromigration analysis.
Skills Required:
EDA Tools. Proficiency in industry-standard software such as Cadence or Siemens for package and PCB design.
Programming & OS. Familiarity with scripting and development tools including Python, Perl, Linux, and SKILL.
Core Engineering. Strong foundation in electrical field theories and electronic fundamentals for packaging solutions.
How to Prepare
Our tips, based only on what the listing asks for:
- Brush up on your fundamentals of electrical field theories and electronic principles.
- Review your hands-on projects or coursework involving EDA tools like Cadence or Siemens.
- Practice basic scripting or programming concepts in Python, Perl, or Linux as relevant to layout design tools.
- Be ready to discuss your experience with physical layout designs, signal integrity, and package routing during technical rounds.
What the Listing Does Not Mention
- No salary package or CTC details are mentioned in the job posting.
- No explicit application deadline or last date to apply is provided.
- No specific interview dates or selection process rounds are detailed.
How to Apply: Intel
- Click the official apply link to visit the Intel Workday job posting page.
- Review the complete job description and qualifications carefully.
- Sign in to your account or create a new profile on the Intel careers portal.
- Upload your updated resume and fill out all necessary application details.
- Submit your job application online.
Shape the future of semiconductor technology with Intel by applying early through their official portal.
Important Links:
| Events | Links |
|---|---|
| Apply Now | Click Here |
| Official Careers Page | Click Here |
Frequently Asked Questions:
What qualification is required?
Required qualification: B.E / B.Tech / M.Tech. See the eligibility section above for details.
Can freshers apply?
Master's degree holders with zero prior professional experience can apply, and Bachelor's degree holders with 1-6 years of experience or academic project background are also eligible.
Where is the job location?
The position is based in Bangalore, India.
What is the work mode?
This role is eligible for Intel's hybrid work model, allowing employees to split time between on-site and off-site work.
Do I need coding skills?
Yes, familiarity with programming languages like Python, Perl, Linux, and/or SKILL is listed as a requirement.
Stay safe: Intel does not charge any fee to apply or to give an interview. If anyone asks you for money for a job, a referral or an offer letter, it is a scam.
Source: the official Intel careers listing for this role.
Related Jobs You May Like
- Join As Analyst (Support & Operations) At HCLTech | Apply Now
- Join As Technology Business Systems Consultant At Wells Fargo | Apply Now
- Join As Supply Chain IT Operations Support At Bosch | Apply Now
- Join As Customer Service Representative At Salesforce | Apply Now
Disclaimer: This job post is for information only. All applications and questions should go to Intel through the official process.
About us:
CareerFinder.co.in: At CareerFinder.co.in, we are committed to connecting individuals with top-notch job opportunities seamlessly. Explore endless possibilities for your career growth and success with us.